The
HMC329 devices are double-balanced MMIC mixers that are available in a chip (
HMC329), a leadless RoHS compliant SMT package (
HMC329LC3B), and an SMT leadless chip carrier package (HMC329LM3). The
HMC329 devices can be used as an upconverter or downconverter. On the
HMC329, the mixer is used as an upconverter or downcnverter in a small chip area of 0.85 mm × 0.55 mm. Excellent isolations are provided by on-chip baluns, and the chip requires no external components and no dc bias. Measurements for the
HMC329 were made with the chip mounted and ribbon bonded into in a 50 Ω microstrip test fixture that contains 5 mil alumina substrates between the chip and K connectors. Measured data includes the parasitic effects of the assembly. RF connections to the chip were made with 0.076 mm (3 mil) ribbon bond with minimal length less than 0.31 mm (<12 mil).
