HMC329LM3 Datasheet

Part No.

In Stock

Price

Packaging

SPQ

Marking

MSL

Pins

Temp Range

Package Description

• Passive: no dc bias required
• Input IP3
  HMC329LM3: 19 dBm
• Local oscillator (LO) to radio frequency (RF) isolation
  HMC329LM3: 35 dBm
• Leadless SMT package, 25 mm2 (HMC329LM3)

• Microwave point-to-point radios 
• Point-to-point radios 
• Point-to-multipoint radios and very small aperture terminal (VSAT)
• Local multipoint distribution systems (LMDS)
• Satellite communications (SATCOM)
• Test equipment and sensors 
• Military end use
• RADAR

The HMC329 devices are double-balanced MMIC mixers that are available in a chip (HMC329), a leadless RoHS compliant SMT package (HMC329LC3B), and an SMT leadless chip carrier package (HMC329LM3). The HMC329 devices can be used as an upconverter or downconverter. On the HMC329, the mixer is used as an upconverter or downcnverter in a small chip area of 0.85 mm × 0.55 mm. Excellent isolations are provided by on-chip baluns, and the chip requires no external components and no dc bias. Measurements for the HMC329 were made with the chip mounted and ribbon bonded into in a 50 Ω microstrip test fixture that contains 5 mil alumina substrates between the chip and K connectors. Measured data includes the parasitic effects of the assembly. RF connections to the chip were made with 0.076 mm (3 mil) ribbon bond with minimal length less than 0.31 mm (<12 mil).