The
HMC329 devices are double-balanced MMIC mixers that are available in a chip (
HMC329), a leadless RoHS compliant SMT package (HMC329LC3B), and an SMT leadless chip carrier package (
HMC329LM3). The
HMC329 devices can be used as an upconverter or downconverter. On the
HMC329, the mixer is used as an upconverter or downcnverter in a small chip area of 0.85 mm × 0.55 mm. Excellent isolations are provided by on-chip baluns, and the chip requires no external components and no dc bias. Measurements for the
HMC329 were made with the chip mounted and ribbon bonded into in a 50 Ω microstrip test fixture that contains 5 mil alumina substrates between the chip and K connectors. Measured data includes the parasitic effects of the assembly. RF connections to the chip were made with 0.076 mm (3 mil) ribbon bond with minimal length less than 0.31 mm (<12 mil).
