ADSP-BF533 Datasheet

• Application-tuned peripherals provide glueless connectivity to general-purpose converters in data acquisition applications
• Large on-chip SRAM for maximum system performance

The ADSP-BF533 provides a high performance, power-efficient processor choice for today's most demanding convergent signal processing applications. The high performance 16-bit/32-bit Blackfin^® embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the dynamic power management (DPM) functionality allow system designers a flexible platform to address a wide range of applications including consumer, communications, automotive, and industrial/instrumentation.

• High performance 16-bit/32-bit embedded processor core
• 10-stage RISC MCU/DSP pipeline with mixed 16-bit/32-bit ISA for optimal code density
• Full SIMD architecture, including instructions for accelerated video and image processing
• Memory management unit (MMU) supporting full memory protection for an isolated and secure environment

High Level of Integration

• Up to 148 kB of on-chip SRAM
• Glueless video capture and display port
• Two dual-channel, full-duplex, synchronous serial ports supporting eight stereo I2S channels
• 12 DMA channels supporting one- and two-dimensional data transfers
• Memory controller providing glueless connection to multiple banks of external SDRAM, SRAM, Flash, or ROM
• 160-ball mini-BGA, 169-ball PBGA packages
• Industrial temperature ranges (40°C to 85°C) and commercial temperature ranges (0°C to 70°C) available